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Title:
HEAT-RESISTANT RELEASE AGENT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/040249
Kind Code:
A1
Abstract:
This heat-resistant release agent composition includes: a polymeric resin adhesion inhibitor; and a heat-resistance improver.

Inventors:
SAKUDO TAKERU (JP)
HIRAMATSU SHINJI (JP)
SUGATA CHIYOSHI (JP)
Application Number:
PCT/JP2019/032800
Publication Date:
February 27, 2020
Filing Date:
August 22, 2019
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Assignee:
NEOS KK (JP)
International Classes:
C09K3/00; B29C33/56; B29C33/62; C08L101/00
Domestic Patent References:
WO2018003432A12018-01-04
Foreign References:
JP2012007117A2012-01-12
JPH03182768A1991-08-08
CN108456385A2018-08-28
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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