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Patent Searching and Data


Title:
HEAT-RESISTANT RELEASE SHEET AND THERMOCOMPRESSION BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/071386
Kind Code:
A1
Abstract:
This heat-resistant release sheet is disposed between a compression bonding target and a thermocompression head when thermocompression bonding of the compression bonding target using the thermocompression head is carried out, and the sheet thereby prevents bonding between the compression bonding target and the thermocompression head. The sheet includes a polytetrafluoroethylene (PTFE) or modified PTFE sheet. However, the content ratio of tetrafluoroethylene (TFE) units in the modified PTFE is at least 99% by mass. With this heat-resistant release sheet, demands for shortening of the time (work time) required for thermocompression bonding can be met with greater certainty.

Inventors:
AKIBA KURATO (JP)
Application Number:
PCT/JP2019/038802
Publication Date:
April 09, 2020
Filing Date:
October 01, 2019
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B29C33/68; C08J5/18; H01L21/60; H01L21/603
Domestic Patent References:
WO2018181403A12018-10-04
Foreign References:
JP2002280403A2002-09-27
JP2000195883A2000-07-14
JP2003236908A2003-08-26
JP2007008153A2007-01-18
JP2013231147A2013-11-14
JP2003268045A2003-09-25
JPH0262532B21990-12-26
JP2014091763A2014-05-19
Attorney, Agent or Firm:
KAMADA Koichi (JP)
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