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Title:
HEAT-RESISTANT RELEASE SHEET AND THERMOCOMPRESSION BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/071387
Kind Code:
A1
Abstract:
During thermocompression bonding of a compression bonding target by a heating/pressing head, this heat resistant release sheet is arranged between the compression bonding target and the heating/pressing head, and prevents adhesion between the compression bonding target and the heating/pressing head. This sheet is configured from a single layer of a heat resistant resin no more than 35 μm thick, and the heat resistant resin configuring the heat resistant resin film has a melting point greater than or equal to 310°C and a glass transition temperature greater than or equal to 210°C. The use temperature of the heat resistant release sheet could be made greater than or equal to 250°C, for example. With this heat resistant release sheet, it is possible to reliably meet demands for rises in thermocompression bonding temperature.

Inventors:
AKIBA KURATO (JP)
YOSHIMATSU KIMIHIKO (JP)
Application Number:
PCT/JP2019/038803
Publication Date:
April 09, 2020
Filing Date:
October 01, 2019
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B29C33/68; C08J5/18; H01L21/60; H01L21/603
Foreign References:
JP2000058587A2000-02-25
JP2016196573A2016-11-24
JP2000195883A2000-07-14
JP2007084707A2007-04-05
JP2003236870A2003-08-26
JP2011201033A2011-10-13
Other References:
YOSHIO IMAI: "Structure-property relationship in polyimides", JOURNAL OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING, vol. 4, no. 7, 1 January 2001 (2001-01-01), pages 640 - 646, XP055702378
Attorney, Agent or Firm:
KAMADA Koichi (JP)
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