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Patent Searching and Data


Title:
HEAT-RESISTANT RELEASE SHEET AND THERMOCOMPRESSION BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/071388
Kind Code:
A1
Abstract:
During thermocompression bonding of a compression bonding target by a heating/pressing head, this heat resistant release sheet is arranged between the compression bonding target and the heating/pressing head and prevents adhesion between the compression target and the heating/pressing head. The surface hardness at 300°C is less than or equal to 15%, represented by the degree of indentation A300 given by the formula A300(%) = (d300/t0)×100. However, t0 is the thickness of the heat-resistant release sheet at room temperature (20°C). d300 is the indentation amount of a needle penetration probe at 300°C in the heat-resistant release sheet, evaluated by thermomechanical analysis (TMA) based on the following measurement conditions. [Measurement conditions] Measurement mode: needle penetration mode, temperature rise measurement; Form and tip diameter of needle penetration probe: cylindrical and 1 mmφ; Applied pressure: 1 MPa; Temperature rise start temperature and rate of temperature rise: 20°C, 10°C/min. With this heat resistant release sheet, it is possible to reliably handle predicted further rises in the thermocompression temperature.

Inventors:
AKIBA KURATO (JP)
YOSHIMATSU KIMIHIKO (JP)
Application Number:
PCT/JP2019/038804
Publication Date:
April 09, 2020
Filing Date:
October 01, 2019
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B29C33/68; C08J5/18; H01L21/60; H01L21/603
Foreign References:
JP2002280403A2002-09-27
JP2000195883A2000-07-14
JP2009119697A2009-06-04
JP2007008153A2007-01-18
JP2002321238A2002-11-05
Attorney, Agent or Firm:
KAMADA Koichi (JP)
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