Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT SEALER PROVIDED WITH INTERFACE TEMPERATURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2021/006230
Kind Code:
A1
Abstract:
The present invention provides a means capable of measuring the temperature of a heat seal surface of an actual machine and adjusting the temperature more accurately. The present invention also provides a heat seal method characterized by comprising, by using a heat seal device for sandwiching a heat seal material between a pair of heating bodies and performing heat-sealing thereon, providing a thin cover material to the surface, of at least one heating body of the heat seal device, in contact with the heat seal material, attaching a micro temperature sensor to the surface of the cover material on a side in contact with the heat seal material, and adjusting the temperature of a welded surface (adhesive surface) on the basis of the temperature detected by the micro temperature sensor. The present invention further provides said heat seal device.

Inventors:
HISHINUMA KAZUO (JP)
Application Number:
PCT/JP2020/026320
Publication Date:
January 14, 2021
Filing Date:
July 06, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HISHINUMA KAZUO (JP)
International Classes:
B65B51/10; B29C65/20; B29C65/38
Foreign References:
JP2015120334A2015-07-02
JP2011167950A2011-09-01
JP2016076019A2016-05-12
JP3056172U1999-02-12
JP2003001708A2003-01-08
JP3465741B22003-11-10
JP4623662B22011-02-02
JP5779291B12015-09-16
Attorney, Agent or Firm:
TANAKA Masahiro (JP)
Download PDF: