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Patent Searching and Data


Title:
HEAT-SHRINKABLE FILM
Document Type and Number:
WIPO Patent Application WO/2022/059651
Kind Code:
A1
Abstract:
[Problem] To obtain a heat-shrinkable film which comprises biodegradable resins, is excellent in terms of stretchability, low-temperature shrinkability, flexibility, etc., and is for use in shrink packaging and which has satisfactory interlaminar adhesion. [Solution] A heat-shrinkable film comprising both outer layers constituted of resin composition A, which comprises a poly(lactic acid)-based resin as a main component, and an interlayer constituted of resin composition B, which comprises an aliphatic/aromatic polyester-based resin as a main component, characterized in that the resin composition A comprises the poly(lactic acid)-based resin and an aliphatic/aromatic polyester-based resin in such a proportion that [poly(lactic acid)-based resin]/[aliphatic/aromatic polyester-based resin]=(70.0-98.0 wt%)/(30.0-2.0 wt%) and the resin composition B comprises a poly(lactic acid)-based resin and the aliphatic/aromatic polyester-based resin in such a proportion that [poly(lactic acid)-based resin]/[aliphatic/aromatic polyester-based resin]=(2.0-20.0 wt%)/(98.0-80.0 wt%).

Inventors:
NAKAMURA TOMOYA (JP)
OHNISHI MAKOTO (JP)
MATSUDA HIROYUKI (JP)
Application Number:
PCT/JP2021/033601
Publication Date:
March 24, 2022
Filing Date:
September 13, 2021
Export Citation:
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Assignee:
OKURA INDUSTRIAL CO LTD (JP)
International Classes:
B32B27/36; B29C61/06; B32B7/028; C08L67/03; C08L67/04; C08L101/16
Foreign References:
JP2005035238A2005-02-10
JP2013510231A2013-03-21
JP2007136770A2007-06-07
JP2006088518A2006-04-06
JP2006015720A2006-01-19
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