Title:
HIGH FREQUENCY DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/033525
Kind Code:
A1
Abstract:
Reduction of the area and size of a high frequency device. A high frequency device which comprises: a first substrate (1) having a first surface (1a) on which a circuit part is formed and a second surface (1b) on which a ground conductor is formed; a second substrate (2) having a third surface (2a) on which an antenna is formed and a fourth surface (2b) on which a second ground conductor is formed; and a conductor plate (3). The conductor plate (3) is sandwiched between the second surface (1b) and the fourth surface (2b).
Inventors:
SUEMATSU EIJI
SATOH KEISUKE
SATOH KEISUKE
Application Number:
PCT/JP2016/066968
Publication Date:
March 02, 2017
Filing Date:
June 07, 2016
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H01Q23/00; H01P3/08; H01P5/08; H01Q13/08
Foreign References:
| JPH0766627A | 1995-03-10 | |||
| JPH06326510A | 1994-11-25 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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