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Title:
HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/200684
Kind Code:
A1
Abstract:
This high-frequency dielectric heating adhesive sheet (1) comprises a first adhesive layer (10), a second adhesive layer (20), and an intermediate layer (30) which is arranged between the first adhesive layer (10) and the second adhesive layer (20), wherein the first adhesive layer (10) contains a first thermoplastic resin and a first dielectric filler that generates heat at a high frequency, the second adhesive layer (20) contains a second thermoplastic resin and a second dielectric filler that generates heat at a high frequency, and the intermediate layer (30) does not contain a dielectric filler that generates heat at a high frequency.

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Inventors:
MORI YUICHI (JP)
TAYA NAOKI (JP)
Application Number:
PCT/JP2021/012956
Publication Date:
October 07, 2021
Filing Date:
March 26, 2021
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B7/027; B32B27/18; C09J7/30; C09J11/04; C09J201/00
Domestic Patent References:
WO2018186297A12018-10-11
Foreign References:
JPH08281873A1996-10-29
JP2014037489A2014-02-27
JPH08258173A1996-10-08
JP2011514852A2011-05-12
JPH1017837A1998-01-20
JP2009538971A2009-11-12
JP2017088764A2017-05-25
JPS5029738B21975-09-26
JPS58174474A1983-10-13
Other References:
See also references of EP 4129663A4
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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