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Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/176778
Kind Code:
A1
Abstract:
This high frequency module comprises: a first substrate which has a first main surface and a second main surface that is on the reverse side of the first main surface; a signal terminal which is provided on the first main surface and performs transmission of signals to/from an external circuit; a power supply terminal which is provided on the second main surface, and to which power supply signals are supplied; an antenna; and a high frequency electronic component which is electrically connected to the signal terminal, the power supply terminal and the antenna, and which controls transmission/reception of the antenna on the basis of the signals and the power supply signals.

Inventors:
UEDA HIDEKI (JP)
Application Number:
PCT/JP2019/009361
Publication Date:
September 19, 2019
Filing Date:
March 08, 2019
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/40; H01L23/12
Domestic Patent References:
WO2012081288A12012-06-21
Foreign References:
JP2014096667A2014-05-22
JP2008235447A2008-10-02
JP2018033078A2018-03-01
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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