Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/039067
Kind Code:
A1
Abstract:
This high-frequency module (1) comprises a module board (91), a power amplifier (11) that amplifies transmission signals of a middle band group, a low-noise amplifier (21) that amplifies reception signals of the middle band group, and an electrically conductive component that transfers high-frequency signals of a high band group, the high-frequency module (1) being such that: the power amplifier (11) is mounted on a main surface (91a) of the module board (91); the low-noise amplifier (21) is mounted on a main surface (91b) of the module board (91); and when the module board (91) is viewed in the plan view, the electrically conductive component is mounted on the main surface (91a or 91b), between the power amplifier (11) and the low-noise amplifier (21).

Inventors:
YAMAGUCHI YUKIYA (JP)
OSHITA TERUAKI (JP)
Application Number:
PCT/JP2020/024593
Publication Date:
March 04, 2021
Filing Date:
June 23, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/18; H01L25/04; H04B1/00; H04B1/38
Domestic Patent References:
WO2014171033A12014-10-23
WO2000028673A12000-05-18
WO2018168500A12018-09-20
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
Download PDF: