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Patent Searching and Data


Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/084848
Kind Code:
A1
Abstract:
The present invention improves the Q value of an inductor unit included in an output matching circuit connected to a power amplifier. An output matching circuit (13A) comprises a plurality of inductor units (L1, L2) and is connected to an output pad electrode (112A) of a power amplifier (11A). In a high-frequency module (1), a second main surface (92) of a first wiring board (9) and a third main surface (101) of a second wiring board (10) face each other. An external connection terminal (80) is disposed on a fourth main surface (102) of the second wiring board (10). The power amplifier (11A) is disposed on a first main surface (91) of the first wiring board (9). In the output matching circuit (13A), at least a part of a first inductor unit that is an inductor unit (L1) closest to the output pad electrode (112A) among the plurality of inductor units (L1, L2) is disposed on the first main surface (91) of the first wiring board (9).

Inventors:
SHOUNAI HIROKI
Application Number:
PCT/JP2020/031152
Publication Date:
May 06, 2021
Filing Date:
August 18, 2020
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; H03H7/38; H03H7/42; H03H7/46; H04B1/38
Foreign References:
JP2000031331A2000-01-28
JP2014112628A2014-06-19
JP2003204013A2003-07-18
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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