Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/065017
Kind Code:
A1
Abstract:
A high-frequency module (1A) comprises a module substrate (91) having a main surface (91a), a first circuit component and second circuit component positioned on the main surface (91a), and a metal shield plate (70) positioned on the main surface (91a) and set to a ground potential. The metal shield plate (70) has a shield part (71) that extends in a direction perpendicular to the main surface (91a), and a joining part (74) that is parallel to the main surface (91a) and extends from the shield part (71) with a gap from the main surface (91a). The top surface of the first circuit component and/or the second circuit component, and the joining part (74), are connected with a bonding wire (81), and when the module substrate (91) is viewed in plan view, the metal shield plate (70) is positioned between the first circuit component and the second circuit component.
Inventors:
UEJIMA TAKANORI (JP)
KITAJIMA HIROMICHI (JP)
KITAJIMA HIROMICHI (JP)
Application Number:
PCT/JP2021/032760
Publication Date:
March 31, 2022
Filing Date:
September 07, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/02; H01L25/04; H01L25/18; H03F1/26; H03F3/189; H03F3/24; H03H9/25; H04B1/00; H04B1/38
Domestic Patent References:
| WO1999021228A1 | 1999-04-29 |
Foreign References:
| JP2005050974A | 2005-02-24 | |||
| JP2018067644A | 2018-04-26 | |||
| JP2015111803A | 2015-06-18 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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