Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/145247
Kind Code:
A1
Abstract:
The present invention addresses the problem of shortening a total wiring length between a reception filter and a low-noise amplifier. This high-frequency module (1) comprises a mounting substrate (6), a plurality of inductors (4), a plurality of reception filters (2), and an IC component. The plurality of inductors (4) are mounted on a first main surface (61) of the mounting substrate (6). The plurality of reception filters (2) are mounted on the first main surface (61) of the mounting substrate (6). The IC component is mounted on a second main surface of the mounting substrate (6), and includes a low-noise amplifier. A rectangular area (A1) in which the plurality of inductors (4) are positioned overlaps the IC component as seen in plan view in the thickness direction of the mounting substrate (6). At each of three or more of the four edges (A21-A24) of the rectangular area (A1), the electronic component closest to the edge of the rectangular area (A1) is at least one of the plurality of reception filters (2).
Inventors:
KANI HIROYUKI
KUROYANAGI TAKUMA
KUROYANAGI TAKUMA
Application Number:
PCT/JP2021/046365
Publication Date:
July 07, 2022
Filing Date:
December 15, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P5/08; H01L25/00; H01L25/10; H01L25/18; H01Q1/50; H04B1/00; H04B1/38
Domestic Patent References:
| WO2019188875A1 | 2019-10-03 | |||
| WO2018168500A1 | 2018-09-20 |
Foreign References:
| JP2020126921A | 2020-08-20 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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