Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2022/044655
Kind Code:
A1
Abstract:
A high-frequency module according to the present invention is provided with: a structured body (1); a filter element (2) arranged on the structured body (1); and a switch element (3) and an impedance element (4) connected to the switch element (3) and the filter element (2), said switch element (3) and impedance element (4) being provided inside the structured body (1). In plan view of the structured body (1), the switch element (3) and the filter element (2) overlap each other at least partially, and the structured body (1) has a plurality of vias including a via (11), a via (12), and a via (13). The via (11) connects an input/output terminal (20) to the filter element (2), and the via (12) connects an impedance adjusting circuit having the switch element (3) and the impedance element (4) to a ground terminal (21). In plan view, the via (13) is located in a minimum rectangular region (A) including the via (11) and the via (12).
Inventors:
TONOE KAZUHITO (JP)
MORI HIROTSUGU (JP)
MORI HIROTSUGU (JP)
Application Number:
PCT/JP2021/027710
Publication Date:
March 03, 2022
Filing Date:
July 27, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/38; H03H9/02; H03H9/17; H03H9/25; H03H9/54; H04B1/38
Domestic Patent References:
| WO2006070616A1 | 2006-07-06 | |||
| WO2018123698A1 | 2018-07-05 |
Foreign References:
| JP2009252919A | 2009-10-29 | |||
| JP2006140863A | 2006-06-01 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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