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Patent Searching and Data


Title:
HIGH-FREQUENCY SUBSTRATE AND HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2010/013721
Kind Code:
A1
Abstract:
Provided are a high-frequency substrate which has reduced size and suppresses unnecessary radiation from a hybrid circuit, and a high-frequency module.  The high-frequency substrate is provided with a first waveguide, a second waveguide, a first conversion section and a second conversion section.  The first waveguide is composed of a laminated waveguide tube including a first conductor layer.  The second waveguide is electromagnetically connected to the first waveguide through an opening formed on the first conductor layer and configures the hybrid circuit.  The first and the second conversion sections are electromagnetically or electrically connected to the first and the second waveguides, respectively, and convert signal transmission mode.

Inventors:
NAKAZURU KAZUMI (JP)
Application Number:
PCT/JP2009/063442
Publication Date:
February 04, 2010
Filing Date:
July 28, 2009
Export Citation:
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Assignee:
KYOCERA CORP (JP)
NAKAZURU KAZUMI (JP)
International Classes:
H01P5/08; H01P3/12; H01P5/107; H01P5/20; H01P5/22; H04B1/38
Domestic Patent References:
WO2009084697A12009-07-09
Foreign References:
JP2000077912A2000-03-14
JPH11308001A1999-11-05
Attorney, Agent or Firm:
SAIKYO, Keiichiro (JP)
Keiichiro Saikyo (JP)
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