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Title:
HIGH-SPEED COMMUNICATION CONNECTOR CAPABLE OF IMPROVING TRANSMISSION QUALITY AND ADJUSTING CHARACTERISTICS
Document Type and Number:
WIPO Patent Application WO/2021/040375
Kind Code:
A1
Abstract:
The present invention relates to a high-speed communication connector capable of improving transmission quality and adjusting characteristics, which reduces signal interference through a shielding structure between a finger structure of a PCB structure and a signal line of a receptacle structure of a dielectric filling structure and facilitates impedance matching through a dielectric and a signal line structure, by using a board-to-board connector for high-speed data communication at a level of 10 to 25 GHz.

Inventors:
YUN HYUN-SU (KR)
KIM JONG-MOON (KR)
YANG DONG-WON (KR)
Application Number:
PCT/KR2020/011309
Publication Date:
March 04, 2021
Filing Date:
August 25, 2020
Export Citation:
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Assignee:
EL TECH CO LTD (KR)
International Classes:
H01R13/6473; H01R12/70; H01R13/6591
Foreign References:
JP4094551B22008-06-04
JP2000067956A2000-03-03
KR20020084275A2002-11-04
JP2006216348A2006-08-17
KR20170073323A2017-06-28
Attorney, Agent or Firm:
DODAM IP LAWFIRM (KR)
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