Title:
HIGH STRENGTH, HIGH HEAT-RESISTANCE ELECTROLYTIC COPPER FOIL, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2013/065699
Kind Code:
A1
Abstract:
[Problem] To provide an electrolytic copper foil which has high mechanical strength in a normal state, and which has a reduced susceptibility to heat degradation, even when heated to approximately 300°C.
[Solution] An electrolytic copper foil and a manufacturing method for the same, said electrolytic copper foil comprising a metal that exists as an oxide in a solution having a pH of 4 or less, or an oxide of said metal.
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Inventors:
EDURA TAKESHI (JP)
SUZUKI AKITOSHI (JP)
SHINOZAKI KENSAKU (JP)
SASAKI HIROKAZU (JP)
YAMAZAKI SATOSHI (JP)
SUZUKI AKITOSHI (JP)
SHINOZAKI KENSAKU (JP)
SASAKI HIROKAZU (JP)
YAMAZAKI SATOSHI (JP)
Application Number:
PCT/JP2012/078078
Publication Date:
May 10, 2013
Filing Date:
October 30, 2012
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D1/04; C25D1/00; C25D15/02; H05K1/09
Foreign References:
JPH07278867A | 1995-10-24 | |||
JPH0967693A | 1997-03-11 | |||
JP2000017476A | 2000-01-18 | |||
JP2007501330A | 2007-01-25 |
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
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Claims:
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