Title:
HOLLOW PARTICLES AND METHOD FOR PRODUCING SAME, RESIN COMPOSITION CONTAINING SAID HOLLOW PARTICLES AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/163738
Kind Code:
A1
Abstract:
The present invention provides: organic hollow particles that enable a low electric permittivity, a low dielectric loss tangent, and a low thermal expansion rate with respect to various electronic materials; and a resin composition including said hollow particles. These hollow particles comprise: a shell part and a hollow part enclosed in the shell part, the shell part being formed of a polymer having a urea bond and/or a urethane bond and being obtained through a reaction between an isocyanate compound having multiple isocyanate groups and an active hydrogen compound having multiple amino groups or hydroxy groups and/or water. The hollow particles satisfy the conditions of: (1) the isocyanate compound is a polymeric MDI; and/or (2) the active hydrogen compound is an acrylic polyol.
Inventors:
SAKAI MAMORU (JP)
SAKAI MAKOTO (JP)
SAKAI MAKOTO (JP)
Application Number:
PCT/JP2022/002990
Publication Date:
August 04, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
SANSUI KK (JP)
International Classes:
C08L75/00; B01J13/16; C08G18/00; C08G18/62; C08G18/76; C08L63/00
Foreign References:
JP2006326457A | 2006-12-07 | |||
JP2006008750A | 2006-01-12 | |||
JP2008031409A | 2008-02-14 | |||
JP2019034283A | 2019-03-07 | |||
JP2007126533A | 2007-05-24 |
Attorney, Agent or Firm:
AKATSUKA Masaki et al. (JP)
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