Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HOLLOW STRUCTURE BODY AND METHOD FOR MANUFACTURING HOLLOW STRUCTURE BODY
Document Type and Number:
WIPO Patent Application WO/2020/129984
Kind Code:
A1
Abstract:
This hollow structure body is provided with: a plate material which has a hollow structure and is a laminate in which a first skin layer, a core layer, and a second skin layer are laminated in this order; and a resin molded part disposed along the end of the plate material. The plate material has an adjacent part extending along the resin molded part. In the adjacent part, at least one of the first and second skin layers is bent towards the other.

More Like This:
WO/2022/002569CONNECTOR ASSEMBLY
WO/2021/047006ELECTROMAGNETIC DIELECTRIC MATERIAL AND METHOD FOR PRODUCING ELECTROMAGNETIC DIELECTRIC MATERIAL
Inventors:
ICHINO KATSUHISA (JP)
Application Number:
PCT/JP2019/049432
Publication Date:
June 25, 2020
Filing Date:
December 17, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
GIFU PLASTIC IND CO LTD (JP)
International Classes:
B32B3/08; B29C45/14; B29C45/26; B29C69/00; B32B3/26; B32B27/00
Domestic Patent References:
WO2009136489A12009-11-12
WO2018079432A12018-05-03
Foreign References:
JP2007526150A2007-09-13
JP2009006556A2009-01-15
US5034256A1991-07-23
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: DECORATIVE SHEET

Next Patent: ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND ELECTRONIC APPARATUS