Title:
HOT MELT COATING AGENT FOR COMPONENT-MOUNTED ELECTRONIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2020/066882
Kind Code:
A1
Abstract:
This invention provides a hot melt coating agent having a superior foam resistant property during application, a short curing time after application, and superior tack-free and bleed-out resistance properties. This invention provides a hot melt coating agent for a component-mounted electronic circuit board, characterized by: containing a thermoplastic resin (A) and a liquid softening agent (B); having a melt viscosity (η1) of 20,000 mPa∙s or smaller at 160°C; having a melt viscosity (η2) of 10,000 mPa∙s or smaller at 180°C; and a ratio (η1/η2) of the melt viscosity (η1) at 160°C and the melt viscosity (η2) at 180°C being 1.0-5.0.
Inventors:
NISHIDA HARUHIKO (JP)
NAGATA YOSHIKI (JP)
YOSHIMURA KEIJI (JP)
NAGATA YOSHIKI (JP)
YOSHIMURA KEIJI (JP)
Application Number:
PCT/JP2019/036937
Publication Date:
April 02, 2020
Filing Date:
September 20, 2019
Export Citation:
Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
H05K3/28; C09D7/65; C09D153/00; C09D191/00; C09D191/06; C09D201/00
Foreign References:
| JPH10265719A | 1998-10-06 | |||
| JP2002115341A | 2002-04-19 | |||
| JP2000219587A | 2000-08-08 | |||
| JP2019119882A | 2019-07-22 | |||
| JP2005194392A | 2005-07-21 |
Other References:
See also references of EP 3860318A4
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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