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Patent Searching and Data


Title:
HOT STAMP MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/145445
Kind Code:
A1
Abstract:
This hot stamp molded body has a chemical composition that contains, in mass%, 0.06% or more but less than 0.20% of C, from 0.010% to 1.00% of Si, from 1.20% to 3.00% of Mn, 0.100% or less of P, 0.010% or less of S, from 0.01% to 0.500% of sol. Al, 0.010% or less of N and from 0.0010% to 0.020% of Nb, while having a microstructure that contains 85% by area or more of martensite. With respect to this hot stamp molded body, the proportion of regions having a GAIQ value of 35,000 or more but less than 45,000 in the martensite is 30% by area or more; the product of the tensile strength TS (MPa) and the maximum bending angle α (deg) in accordance with the standards of the German Association of the Automotive Industry VDA 238-100, namely (TS × α) is 105,000 or more; and the value of α is 75 or more. This hot stamp molded body has high strength and excellent bendability.

Inventors:
FUJINAKA SHINGO (JP)
MAEDA DAISUKE (JP)
TODA YURI (JP)
Application Number:
PCT/JP2021/001334
Publication Date:
July 22, 2021
Filing Date:
January 15, 2021
Export Citation:
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Assignee:
NIPPON STEEL CORP (JP)
International Classes:
C21D9/00; C21D1/18; C21D9/46; C22C38/00; C22C38/58
Domestic Patent References:
WO2019020575A12019-01-31
WO2007129676A12007-11-15
WO2020189761A12020-09-24
Foreign References:
JP2018527457A2018-09-20
JP2004315927A2004-11-11
JP2015196890A2015-11-09
JP2010070806A2010-04-02
JP2011224646A2011-11-10
Attorney, Agent or Firm:
BRIGHTAS IP ATTORNEYS (JP)
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