Title:
IC MODULE AND METHOD FOR MANUFACTURING IC MODULE
Document Type and Number:
WIPO Patent Application WO/2021/171671
Kind Code:
A1
Abstract:
An IC module (101) is provided with: an IC (2) having terminal electrodes (21); and a substrate (1) which has first and second surfaces (MS1, MS2) opposite to each other and which has formed on the first surface (MS1) lands (12) connected to the terminal electrodes (21) of the IC (2). An insulator layer (3) covering the outside of a forming region of the lands (12) is formed on the first surface (MS1) of the substrate (1). The difference in thickness between the insulator layer (3) and the IC (2) is less than the difference in thickness between the insulator layer (3) and the substrate (1), and the thickness of the substrate (1) is less than that of the insulator layer (3).
Inventors:
KATO NOBORU (JP)
Application Number:
PCT/JP2020/036706
Publication Date:
September 02, 2021
Filing Date:
September 28, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/12; G06K19/02; G06K19/077; H01L21/60; H05K3/32; H05K3/34
Domestic Patent References:
| WO2018194173A1 | 2018-10-25 |
Foreign References:
| JPH08307045A | 1996-11-22 | |||
| JP2000340614A | 2000-12-08 | |||
| JP2017153009A | 2017-08-31 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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