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Patent Searching and Data


Title:
IC SOCKET SET
Document Type and Number:
WIPO Patent Application WO/2007/043270
Kind Code:
A1
Abstract:
Provided is an IC socket set which ensures degrees of freedom in layout of an electric circuit board. The IC socket set (1) is provided with a package receiving unit (20), and a package fixing unit (30) combined with the package receiving unit. The package receiving unit (20) is provided with an insulating housing (21) and a contact (22). Since an opening (311) of the base material plate (31) fits in the insulating housing (21) even in a direction rotated 180 degrees, at the time of combining the package fixing unit (30) having an opening/closing member (33) with the package receiving unit (20), the direction of one side (312) whereupon the opening/closing member (33) is arranged can be selected among a plurality of directions, irrespective of the direction wherein the package receiving unit (20) is connected.

Inventors:
TODA SHINSAKU (JP)
INOUE MASASHI (JP)
YAMAMOTO YOSHIHISA (JP)
Application Number:
PCT/JP2006/318026
Publication Date:
April 19, 2007
Filing Date:
September 12, 2006
Export Citation:
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Assignee:
TYCO ELECTRONICS AMP KK (JP)
TODA SHINSAKU (JP)
INOUE MASASHI (JP)
YAMAMOTO YOSHIHISA (JP)
International Classes:
C08F2/44; C08F2/38; C08F2/46; G02B5/20; G02F1/1335; G03F7/004; G03F7/033; H01R33/76
Foreign References:
JP2005174912A2005-06-30
JP2002260801A2002-09-13
JP2004022273A2004-01-22
JP2005108615A2005-04-21
Attorney, Agent or Firm:
YAMADA, Masaki et al. (Nishi-shimbashi 3-chome Minato-ku, Tokyo03, JP)
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