IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2015/151172

A1

The present invention addresses the problem of providing: an image pickup device wherein, with a simple structure, suitable parallelism is achieved between a surface emission source array and an acceleration electrode; and a method for manufacturing the image pickup device. This image pickup device is provided with: a lower substrate (21); an electron emission source array (22) that is mounted on the lower substrate (21) with a die bonding material (24) therebetween, said die bonding material having plasticity; a peripheral wall section (6) that is provided on the lower substrate (21) such that the peripheral wall section surrounds the electron emission source array (22); and an acceleration electrode (5), which is set to a supporting section (31) that is provided in the peripheral wall section (6), and which accelerates electrons emitted from the electron emission source array (22). The electron emission source array (22) is mounted such that the electron emission source array is in parallel to a virtual plane configured from the supporting section (31).

SAKAI TOMOKAZU (JP)
KANEDA HIROKI (JP)
IWASAKI SHINGO (JP)

PCT/JP2014/059492

October 08, 2015

March 31, 2014

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PIONEER CORP (JP)

H01J31/28; H01J9/18; H01J29/04; H01J29/82; H01J29/86; H01J31/49

JP2009272289A	2009-11-19
JP2009163972A	2009-07-23
JPH08139298A	1996-05-31
JPS6481579A	1989-03-27
JPS5621382A	1981-02-27
JP2007019423A	2007-01-25
JPH05101774A	1993-04-23

SHINRYO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation SHINRYO international patent firm (JP)

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