Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
IMAGE SENSING MODULE, CAMERA MODULE, TERMINAL DEVICE AND MOLD
Document Type and Number:
WIPO Patent Application WO/2021/203640
Kind Code:
A1
Abstract:
The present application relates to the field of heat dissipation of electronic devices, and disclosed are an image sensing module (1000), a camera module (2000), terminal device, and a mold. The image sensing module comprises a printed circuit board (PCB) (1), an image sensor (2), a packaging layer (3) and heat conduction liquid (5). The PCB (1) is provided with a circuit that matches the image sensor (2), and the circuit is internally provided with necessary electronic components, such as resistors and capacitors. The image sensor (2) is arranged on the PCB (1) and is used for receiving image information. The heat conduction liquid (5) may absorb heat of the packaging layer at a part where heating is serious and transmit same to the packaging layer at the part where there is relatively little heating, so that the surfaces of all parts of the packaging layer may release the heat to the air, and the heat dissipation effect is further improved.

Inventors:
LUO ZHENDONG (CN)
RAN KUN (CN)
MIAO WEILIANG (CN)
Application Number:
PCT/CN2020/118105
Publication Date:
October 14, 2021
Filing Date:
September 27, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H04N5/225
Foreign References:
CN206743368U2017-12-12
CN110767667A2020-02-07
CN208754401U2019-04-16
CN104956658A2015-09-30
Attorney, Agent or Firm:
SHENZHEN ZHONGYI UNION INTELLECTUAL PROPERTY AGENCY CO.,LTD. (CN)
Download PDF: