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Title:
IMAGE SENSOR PACKAGE AND CAMERA DEVICE INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2021/235744
Kind Code:
A1
Abstract:
A camera device according to an embodiment of the present invention comprises: a printed circuit board; a heat radiation layer disposed on a first surface of the printed circuit board; and an image sensor disposed on the heat radiation layer, wherein the printed circuit board has a plurality of through-holes passing from the first surface of the printed circuit board to a second surface of the printed circuit board, which is the reverse surface of the first surface, and the plurality of through-holes are in contact with the heat radiation layer.

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Inventors:
EOM SEONG SU (KR)
LEE SOL IP (KR)
LEE HEE JUNG (KR)
Application Number:
PCT/KR2021/005663
Publication Date:
November 25, 2021
Filing Date:
May 06, 2021
Export Citation:
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Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L27/146; H04N5/225; H05K1/02; H05K1/11
Foreign References:
US20190246490A12019-08-08
KR20120017242A2012-02-28
KR20110127913A2011-11-28
KR20160061242A2016-05-31
JP2006191465A2006-07-20
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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