Title:
IMAGING DEVICE AND ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2021/152658
Kind Code:
A1
Abstract:
An imaging device 1 that comprises a layered element 30 in which a plurality of semiconductor elements 10A–10D that have respective through electrodes 15A–15D are layered so as to sequentially sandwich a plurality of intermediate layers 20A–20C that have respective bonding conductors 25A–25C. A first semiconductor element that, of semiconductor elements 10A–10D, includes the through electrode 15A that has the highest thermal resistance is arranged in front of a first surface at which a first circuit that is a semiconductor circuit that generates the most heat is formed.
Inventors:
SUYAMA TAKURO (JP)
YAMAMOTO KEN
IGARASHI TAKATOSHI
YAMAMOTO KEN
IGARASHI TAKATOSHI
Application Number:
PCT/JP2020/002758
Publication Date:
August 05, 2021
Filing Date:
January 27, 2020
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B1/04; H01L27/146; A61B1/12; H01L21/3205; H01L21/768; H01L23/522; H01L25/065; H01L25/07; H01L25/18; H04N5/369
Domestic Patent References:
| WO2019138442A1 | 2019-07-18 | |||
| WO2017057291A1 | 2017-04-06 | |||
| WO2017073440A1 | 2017-05-04 | |||
| WO2017072862A1 | 2017-05-04 | |||
| WO2018193531A1 | 2018-10-25 |
Foreign References:
| JP2013021031A | 2013-01-31 | |||
| JP2013201568A | 2013-10-03 | |||
| JP2012142458A | 2012-07-26 |
Attorney, Agent or Firm:
ITOH-SHIN PATENT OFFICE (JP)
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