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Patent Searching and Data


Title:
IMAGING DEVICE AND MANUFACTURING METHOD FOR IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/111716
Kind Code:
A1
Abstract:
The present invention improves the positioning precision of an imaging element and an imaging lens. This imaging device is equipped with an imaging element, a wiring board, a sealing part, and a fitting part. The imaging element comprises: an imaging chip in which a light-transmitting part that transmits incident light is provided and which generates an image signal on the basis of the incident light that has traversed the light-transmitting part; and a pad which is disposed on the bottom surface of the imaging chip, which is different from the surface where the light-transmitting part is provided, and conveys the generated image signal. The wiring board comprises wiring connected to the pad and has the imaging element disposed on the top surface thereof. The sealing part is disposed adjacent to a side surface that is adjacent to the bottom surface of the imaging chip, and seals the imaging chip. The fitting part is disposed on the sealing part and fits part of a lens unit that forms an optical image on the imaging element.

Inventors:
TSUJI MUTSUO (JP)
CHINO DAISUKE (JP)
Application Number:
PCT/JP2020/037164
Publication Date:
June 10, 2021
Filing Date:
September 30, 2020
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/12; G02B7/00; G02B7/02; H01L21/56; H01L23/29; H01L23/31; H01L27/146; H04N5/369
Domestic Patent References:
WO2016129409A12016-08-18
Foreign References:
JPH0321859A1991-01-30
JPH0562057A1993-03-12
JP2001308302A2001-11-02
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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