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Patent Searching and Data


Title:
IMAGING DEVICE AND METHOD FOR MANUFACTURING IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/111715
Kind Code:
A1
Abstract:
Provided is an imaging device configuration to which a simple mounting method can be applied. This imaging device is provided with an imaging element, a wiring board, and a sealing portion. The imaging element is provided with: an imaging chip in which an optically transmissive portion transmissive to incident light is disposed and which generates an image signal on the basis of the incident light that has passed through the optically transmissive portion; and a pad disposed on a bottom surface of the imaging chip different from a surface on which the optically transmissive portion is disposed, the pad transmitting the generated image signal. The wiring board has a wire connected to the pad and extending to a region outside the imaging element, and has the imaging element disposed on a surface thereof. The sealing portion is disposed adjacent to a side surface which is a surface adjacent to the bottom surface of the imaging element, and seals the imaging element.

Inventors:
NAGATA MASAYA (JP)
Application Number:
PCT/JP2020/037159
Publication Date:
June 10, 2021
Filing Date:
September 30, 2020
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L23/12; H01L21/56; H01L23/29; H01L23/31; H01L27/146; H04N5/369
Domestic Patent References:
WO2017094777A12017-06-08
WO2016129409A12016-08-18
Foreign References:
JPH0321859A1991-01-30
JPH0226080A1990-01-29
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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