Title:
IMAGING ELEMENT AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/090545
Kind Code:
A1
Abstract:
The present invention prevents decrease in the visibility of an alignment mark of an imaging device which is configured by bonding a plurality of semiconductor substrates. An imaging element according to the present invention is provided with a semiconductor substrate, a pad, an alignment mark and a light-blocking film. The semiconductor substrate is provided with a pixel area where a pixel, which produces an image signal in accordance with incident light, is arranged. The pad is arranged on the front surface side of the semiconductor substrate. The alignment mark is arranged on the back surface side of the semiconductor substrate. The light-blocking film is arranged between the pad and the alignment mark.
Inventors:
TAKATA DAIZO (JP)
Application Number:
PCT/JP2020/028952
Publication Date:
May 14, 2021
Filing Date:
July 29, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L25/065; H01L21/3205; H01L21/768; H01L23/522; H01L25/07; H01L25/18; H01L27/146; H04N5/335
Foreign References:
| JP2014157885A | 2014-08-28 | |||
| JP2013041940A | 2013-02-28 | |||
| JP2008147332A | 2008-06-26 | |||
| JP2009259934A | 2009-11-05 | |||
| JP2016115757A | 2016-06-23 | |||
| US20120193741A1 | 2012-08-02 |
Attorney, Agent or Firm:
MATSUO Kenichiro (JP)
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