Title:
IMAGING ELEMENT, AND DISTANCE MEASUREMENT MODULE
Document Type and Number:
WIPO Patent Application WO/2021/153299
Kind Code:
A1
Abstract:
The present technology relates to an imaging element and a distance measurement module which can reduce parasitic capacitance. The present invention comprises: first wiring which connects predetermined transistors in first adjacent pixels to each other and connects a via formed in one pixel of first adjacent pixels and connected to wiring formed in another layer; and second wiring which connects predetermined transistors in second adjacent pixels to each other and connects a via formed in a pixel adjacent to one pixel of second adjacent pixels and connected to wiring formed in another layer, wherein the first wiring is connected to redundant wiring. The present technology can be applied to, for example, a distance measurement sensor for performing distance measurement.
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Inventors:
ARAI HIDEKI (JP)
OTAKE YUSUKE (JP)
MURASE TAKURO (JP)
YAMAZAKI TAKESHI (JP)
OTAKE YUSUKE (JP)
MURASE TAKURO (JP)
YAMAZAKI TAKESHI (JP)
Application Number:
PCT/JP2021/001414
Publication Date:
August 05, 2021
Filing Date:
January 18, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/374; G01S7/481; G01S17/08; H01L21/3205; H01L21/768; H01L23/522; H01L27/146; H04N5/369; H04N5/3745
Foreign References:
| JP2020009883A | 2020-01-16 | |||
| JP2009212618A | 2009-09-17 | |||
| JP2013038100A | 2013-02-21 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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