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Patent Searching and Data


Title:
IMAGING UNIT AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/045241
Kind Code:
A1
Abstract:
Provided is an imaging unit with which it is possible to improve imaging quality by preventing an imaging element from being warped, and an imaging device equipped with the imaging unit. The imaging unit (50) is provided with: an imaging element chip (1); a package substrate (2) on which the imaging element chip (1) is mounted; a bonding member (5) for bonding a rear surface of the imaging element chip (1) opposite to a light receiving surface (10) to a bottom surface (2d) that is a mounting surface of the package substrate (2) for the imaging element chip (1); and a circuit substrate (52) bonded to a rear surface of the package substrate (2) opposite to the bottom surface (2d). The bonding member (5) comprises: a central bonding portion (5a) to be bonded to a central portion (1A) of the imaging element chip (1); and a periphery bonding portion (5b) to be bonded to a peripheral portion (1B) separated from the central portion (1A) of the imaging element chip (1).

Inventors:
MAYUMI KAZUYA (JP)
Application Number:
PCT/JP2019/032894
Publication Date:
March 05, 2020
Filing Date:
August 22, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L27/146; H04N5/369
Domestic Patent References:
WO2016132883A12016-08-25
Foreign References:
JP2006269784A2006-10-05
JP2015032653A2015-02-16
JP2012095177A2012-05-17
JP2003243637A2003-08-29
JP2004335628A2004-11-25
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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