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Patent Searching and Data


Title:
IN-MOLD INJECTION MOLD DEVICE AND RESIN MOLDED PRODUCT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/099050
Kind Code:
A1
Abstract:
This in-mold injection mold device (100) has: a first mold (10) which has a cavity (11a); a second mold (20) which has a core (21); a clamper (40) which clamps a decorative film (30) from both sides while sealing a first surface (31) of the decorative film (30), and which presses the decorative film (30) against a first split surface (13) of the first mold (10); and a suction path (14) for reducing pressure in a sealed space (11b) between the decorative film (30) and the cavity surface (11). The clamper (40) includes one or more clamping members (51, 61) which are elastically supported such that, with the decorative film (30) still in a state clamped from both sides, said clamping members can move toward the cavity (11a) due to the tensile force acting on the decorative film (30) at the time of a suction step.

Inventors:
SEDOU TOUTA (JP)
Application Number:
PCT/JP2016/086152
Publication Date:
June 15, 2017
Filing Date:
December 06, 2016
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
International Classes:
B29C45/16; B29C33/18; B29C45/26
Foreign References:
JP2001096571A2001-04-10
JPH0760791A1995-03-07
JPH1134104A1999-02-09
JP2011104962A2011-06-02
JP2007136976A2007-06-07
JP2014133371A2014-07-24
JP2000254939A2000-09-19
Attorney, Agent or Firm:
FUKUI, HIROSHI (JP)
Hiroshi Fukui (JP)
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