Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
IN-MOLD INJECTION MOLD DEVICE AND RESIN MOLDED PRODUCT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/099051
Kind Code:
A1
Abstract:
This in-mold injection mold device (100) is provided with a first mold (10) which has a cavity (11a), a second mold (20) which has a core (21), a clamper (40) which presses the decorative film (30) against a first split surface (13) of the first mold (10), and a suction path (14) for sucking the air in the sealed space (11b) between the decorative film (30) and the cavity surface (11). The clamper (40) has a pressing member (41) made from a flexible material that presses the decorative film (30) against the first mold (10). The pressing member (41) is configured such that, with the decorative film (30) still clamped between the pressing member (41) and the first mold (10), said pressing member is deflected by the tensile force acting on the decorative film (30) at the time of suction processing and moves towards the cavity (11a).

Inventors:
SEDOU TOUTA (JP)
Application Number:
PCT/JP2016/086153
Publication Date:
June 15, 2017
Filing Date:
December 06, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAIKIN IND LTD (JP)
International Classes:
B29C45/16; B29C33/18; B29C45/34
Foreign References:
JP2001096571A2001-04-10
JPH0760791A1995-03-07
JPH1134104A1999-02-09
JP2011104962A2011-06-02
JP2007136976A2007-06-07
JP2014133371A2014-07-24
JP2000254939A2000-09-19
Attorney, Agent or Firm:
FUKUI, HIROSHI (JP)
Hiroshi Fukui (JP)
Download PDF: