INDIUM COMPOUND, RAW MATERIAL FOR FORMING THIN FILM, THIN FILM, AND METHOD FOR PRODUCING SAME

Title:

INDIUM COMPOUND, RAW MATERIAL FOR FORMING THIN FILM, THIN FILM, AND METHOD FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2022/118834

Kind Code:

A1

Abstract:

An indium compound represented by general formula (1).　[Chemical formula 1] (In the formula, R1 and R2 each independently represent an unsubstituted C1-5 alkyl group, etc., R3 and R4 each independently represent a hydrogen atom, an unsubstituted C1-5 alkyl group, etc., and A represents a group represented by general formula (L-1) or (L-2).)　[Chemical formula 2] (In the formula, R11, R12, R13, R14, R21, and R22 each independently represent a hydrogen atom, an unsubstituted C1-5 alkyl group, etc., and * represents a bonding position with C in general formula (1).)

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Inventors:

TAKEDA KEISUKE (JP)
ENZU MASAKI (JP)

Application Number:

PCT/JP2021/043816

Publication Date:

June 09, 2022

Filing Date:

November 30, 2021

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Assignee:

ADEKA CORP (JP)

International Classes:

C07F5/00; C23C16/18

Domestic Patent References:

WO2019203407A1

2019-10-24

Foreign References:

KR20100054317A	2010-05-25
KR20100054313A	2010-05-25

Other References:

MAEDA, T. ; OKAWARA, R.: "Preparation and properties of organoindium complexes", JOURNAL OF ORGANOMETALLIC CHEMISTRY, vol. 39, no. 1, 1 June 1972 (1972-06-01), AMSTERDAM, NL , pages 87 - 91, XP026638756, ISSN: 0022-328X, DOI: 10.1016/S0022-328X(00)88906-8

Attorney, Agent or Firm:

SOGA, Michiharu et al. (JP)

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