Title:
INDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/084928
Kind Code:
A1
Abstract:
Provided are an inductor element and a semiconductor device that can be downsized. An inductor element comprises a first semiconductor chip including a first inductor, a second semiconductor chip that is disposed so as to face the first semiconductor chip and includes a second inductor, and a connecting portion that is provided on at least one of the first semiconductor chip and the second semiconductor chip and electrically connects the first inductor and the second inductor. The first inductor and the second inductor face each other. The direction in which a current flows in the first inductor and the direction in which a current flows in the second inductor are identical to each other.
Inventors:
MASUDA TAKASHI (JP)
Application Number:
PCT/JP2019/035148
Publication Date:
April 30, 2020
Filing Date:
September 06, 2019
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01F17/00; H01F27/36; H01L23/12
Domestic Patent References:
| WO2017141505A1 | 2017-08-24 |
Foreign References:
| JP2000182851A | 2000-06-30 | |||
| JP2009188343A | 2009-08-20 | |||
| JP2008198929A | 2008-08-28 | |||
| JP2013520031A | 2013-05-30 |
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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