INFRARED ABSORBING COMPOSITION, INFRARED CUT FILTER, LAMINATION, PATTERN FORMING METHOD, AND SOLID-STATE IMAGE CAPTURING ELEMENT

Title:

INFRARED ABSORBING COMPOSITION, INFRARED CUT FILTER, LAMINATION, PATTERN FORMING METHOD, AND SOLID-STATE IMAGE CAPTURING ELEMENT

Document Type and Number:

WIPO Patent Application WO/2016/186050

Kind Code:

A1

Abstract:

The present invention provides: an infrared absorbing composition that is used to form an infrared cut filter for a solid-state image capturing element having the infrared cut filter, that has an absorption peak at or above a wavelength of 650 nm, and that contains at least one kind of infrared absorber selected from polymethine dyes; a pattern forming method using the infrared absorbing composition; an infrared cut filter formed by curing the infrared absorbing composition; and a laminated body and solid-state image capturing element that include the infrared cut filter.

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Inventors:

OOTA KAZUYA (JP)
SASAKI DAISUKE (JP)
HIRAI YUKI (JP)
OKAWARA TAKAHIRO (JP)
SHIMADA KAZUTO (JP)
ARIMURA KEISUKE (JP)

Application Number:

PCT/JP2016/064366

Publication Date:

November 24, 2016

Filing Date:

May 13, 2016

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

C09B23/00; G02B5/22; H01L27/14

Domestic Patent References:

WO2015056734A1	2015-04-23
WO2012169447A1	2012-12-13

Foreign References:

JP2007271745A	2007-10-18
JP2007141876A	2007-06-07
JP2008091535A	2008-04-17
JP2016045372A	2016-04-04
JP2015203863A	2015-11-16

Other References: