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Patent Searching and Data


Title:
INGOT CUTTING METHOD AND WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2019/220820
Kind Code:
A1
Abstract:
The present invention provides an ingot cutting method whereby a wire row is formed by a wire wound spirally between a plurality of wire guides and running in an axial direction, and, while a slurry is being supplied from a nozzle to a contact portion between the ingot and the wire, the ingot is pressed onto the wire row to thereby cut the ingot into wafers, wherein the supplying of slurry includes supplying the slurry that has been temperature-controlled individually by two or more systems of heat exchangers from two or more sections of the nozzle that are orthogonal to a running direction of the wire row. Thus, a wire saw and an ingot cutting method are provided with which it is possible to control wafer shape individually depending on the cutting site of the ingot.

Inventors:
KANBAYASHI KEIICHI (JP)
Application Number:
PCT/JP2019/015533
Publication Date:
November 21, 2019
Filing Date:
April 10, 2019
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B27/06; B24B57/02; B28D5/04; H01L21/304
Foreign References:
JP5003294B22012-08-15
JP2010029955A2010-02-12
JP2009029078A2009-02-12
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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