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Patent Searching and Data


Title:
INGOT CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/173693
Kind Code:
A1
Abstract:
The present invention provides an ingot cutting method using a wire saw, the method comprising forming a wire column from a wire wound spirally between a plurality of wire guides and travelling in an axial direction, cut-feeding the ingot being held by means of a workpiece feed mechanism onto the wire column, and cutting the ingot into a plurality of wafers while supplying a slurry into a contact portion between the ingot and the wire. The ingot cutting method is characterized in that the direction of warping in the wire travel direction of a wafer obtained by the cutting of a previous ingot is confirmed in advance, and then an ingot is cut under a condition in which the direction of warping in the workpiece feed direction is matched with the confirmed direction of warping in the wire travel direction, whereby a wafer in which the direction of warping in the wire travel direction and that of warping in the workpiece feed direction are the same is obtained. In this way, there is provided an ingot cutting method with which a wafer not subject to waviness in a plane after epitaxial processing can be obtained.

Inventors:
KANBAYASHI KEIICHI (JP)
Application Number:
PCT/JP2018/007998
Publication Date:
September 27, 2018
Filing Date:
March 02, 2018
Export Citation:
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Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
H01L21/304; B24B27/06; B24B55/02; B28D5/04
Domestic Patent References:
WO2015125366A12015-08-27
Foreign References:
JP2008213110A2008-09-18
JP2008078474A2008-04-03
JP2005103683A2005-04-21
JP2003145406A2003-05-20
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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