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Patent Searching and Data


Title:
INJECTION MOLDING APPARATUS, INJECTION MOLDING METHOD AND MOLDING PRODUCTION METHOD USING SAID APPARATUS, AND LAMINATED LENS
Document Type and Number:
WIPO Patent Application WO/2020/230889
Kind Code:
A1
Abstract:
The injection molding apparatus (10) according to the present invention is provided with: a substantially circular first substrate (12); a substantially circular second substrate (14) that is disposed so as to face a surface (12a) of the first substrate (12); a fixing member (16) for fixing circumferential ends of the first substrate (12) and the second substrate (14); and an injection part (18) that is provided to the fixing member (16) and that is for injecting a composition into a gap (20) between the first substrate (12) and the second substrate (14), wherein at least a portion of the peripheral edges of the gap (20) is provided with a space (22) that connects between the injection part (18) and the gap (20), and said space (22) has a thickness-direction width greater than that of the gap (20).

Inventors:
KAWAGUCHI MASARU (JP)
ITO SHINSUKE (JP)
SUESUGI KOUJI (JP)
Application Number:
PCT/JP2020/019438
Publication Date:
November 19, 2020
Filing Date:
May 15, 2020
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B29C39/24; B29C39/26
Domestic Patent References:
WO2011055540A12011-05-12
WO2016125736A12016-08-11
Foreign References:
JP2003231135A2003-08-19
JPH0258916A1990-02-28
JPH09254170A1997-09-30
JP2006205710A2006-08-10
JP2018072851A2018-05-10
JPS6187757A1986-05-06
JPS61285259A1986-12-16
JPS62270664A1987-11-25
JPS62275163A1987-11-30
JPH113667A1999-01-06
JP2019092682A2019-06-20
Other References:
See also references of EP 3970940A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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