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Patent Searching and Data


Title:
INJECTION MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/241744
Kind Code:
A1
Abstract:
Provided is an injection molding device that enables the temperature of a nozzle tip portion to be adjusted and controlled, and enables the temperature to be maintained within a favorable temperature range without excessive drop or rise in temperature. A hot runner-type injection structure 4 is provided with: a hot runner nozzle 5 that has a heating part 8 on the outer circumferential side thereof and a flow passage extending in the axial line O1 from the rear end to the front end and communicating with a cavity H; and a valve pin 6 that is provided to be able to advance and retreat in the axial line O1 direction inside the flow passage of the hot runner nozzle 5 and that opens/closes the flow passage by coming into contact/being spaced apart from a valve opening/closing part 13 which has a tip part disposed on the tip side of the hot runner nozzle 5, wherein a heat insulating groove 16, which is recessed inward toward the axial line O1 side from an outer circumferential surface and extends in the circumferential direction, is provided on the outer periphery in a valve pin contact section M in which the valve opening/closing part 13 of the hot runner nozzle 5 is formed.

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Inventors:
MATSUSHIMA HIROSHI (JP)
Application Number:
PCT/JP2020/021095
Publication Date:
December 03, 2020
Filing Date:
May 28, 2020
Export Citation:
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Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B29C45/27
Foreign References:
JPS55146723A1980-11-15
JPS54116565U1979-08-15
JP2002347074A2002-12-04
JPS5351904Y11978-12-12
JPH0985782A1997-03-31
JP2000117776A2000-04-25
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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