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Patent Searching and Data


Title:
INSERT MOLDED PRODUCT AND METHOD FOR MANUFACTURING INSERT MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/054023
Kind Code:
A1
Abstract:
The insert molded product 1 according to the present invention is provided with: a metal plate 3 that is for a lead frame and that is provided with a penetration space 2 in which a semiconductor chip 51 is disposed; and a resin member 4 having outer resin parts 4a, 4b arranged along at least a portion of the peripheral outside of the penetration space 2 on both surfaces of the metal plate 3, wherein the penetration space 2 has a plurality of cut-outs 5 extending between the outer resin parts 4a, 4b on both surfaces toward the outside from the penetration space 2, the outer resin parts 4a, 4b on both surfaces are coupled to each other by a resin part 4c located inside the cut-outs 5, and a gate mark 6 is provided to each of the positions of the outer resin parts 4a, 4b where at least two cut-outs 5 are present.

Inventors:
AOYAGI MAKOTO (JP)
TSUKAMOTO RYOTA (JP)
OHSUGI KOJI (JP)
WAKAMATSU MOTOTAKA (JP)
Application Number:
PCT/JP2020/031150
Publication Date:
March 25, 2021
Filing Date:
August 18, 2020
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
B29C45/14; H01L21/56
Foreign References:
JP2007268819A2007-10-18
JPH07329104A1995-12-19
JP2007069602A2007-03-22
JPH06111653A1994-04-22
JPH088363A1996-01-12
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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