Title:
INSULATING PLATE AND PREPARATION METHOD THEREFOR, LAMINATED PLATE AND PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/061971
Kind Code:
A1
Abstract:
An insulating plate and a preparation method therefor, a laminated plate and a preparation method therefor, and an application thereof, the insulating plate comprising a fiber layer, a first resin layer that coats the fiber layer, a second resin layer that coats the first resin layer, and a third resin layer that coats the second resin layer. The first resin layer is made of a PFA resin or a mixture of the PFA resin and a PTFE resin at a mass ratio of 1/9-6/4; the second resin layer is made of a mixture of the PFA resin and the PTFE resin at a mass ratio of 1/9-6/4; and the third resin layer is made of a mixture of the PFA resin and the PTFE resin at a mass ratio of 1/9-6/4. The mass parts of the fiber layer is 5 parts-50 parts, and the total mass parts of the first resin layer, the second resin layer and the third resin layer is 50 parts-95 parts. The insulating plate has the features of low porosity, low water absorption, being low cost and excellent bending resistance, and can satisfy future requirements of electronic components in the high-frequency field for printed circuit boards.
Inventors:
WANG HONGYUAN (CN)
ZHANG YILAN (CN)
WANG HEZHI (CN)
ZHANG YILAN (CN)
WANG HEZHI (CN)
Application Number:
PCT/CN2020/120365
Publication Date:
March 31, 2022
Filing Date:
October 12, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC MODULE TECH CHANGZHOU CO LTD (CN)
AAC MODULE TECH CHANGZHOU CO LTD (CN)
International Classes:
B05C3/02; B05D7/24; B32B38/08; D06M15/256
Domestic Patent References:
| WO2008129784A1 | 2008-10-30 |
Foreign References:
| CN102114453A | 2011-07-06 | |||
| CN102173175A | 2011-09-07 | |||
| CN105862421A | 2016-08-17 | |||
| CN106633785A | 2017-05-10 |
Attorney, Agent or Firm:
SHENZHEN CIPRUN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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