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Title:
INSULATING RESIN COMPOSITION, INSULATING RESIN CURED BODY, LAYERED BODY, AND CIRCUIT BASE BOARD
Document Type and Number:
WIPO Patent Application WO/2021/090630
Kind Code:
A1
Abstract:
An insulating resin composition comprising an organic material and an inorganic filler, wherein the organic material contains an epoxy resin, a curing agent, a phosphate ester compound having one or more hydroxyl group per molecule, a heavy metal inactivator, and a hindered phenol-based antioxidant, and the contained amount of the inorganic filler is 50-95 mass%.

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JP2022061729RESIN COMPOSITION, METAL FOIL WITH RESIN, PREPREG, LAMINATED PLATE, MULTILAYER PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
Inventors:
KIMOTO YUUKI (JP)
KUMAGAI RYOTA (JP)
YASHIMA KATSUNORI (JP)
Application Number:
PCT/JP2020/038031
Publication Date:
May 14, 2021
Filing Date:
October 07, 2020
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08L63/00; C08K3/013; C08K5/13; C08K5/25; C08K5/3472; C08K5/521; H05K1/05
Domestic Patent References:
WO2013147086A12013-10-03
WO2015056523A12015-04-23
WO2010087254A12010-08-05
WO2019009294A12019-01-10
Foreign References:
JP2004075817A2004-03-11
JP2005353974A2005-12-22
JPH10242606A1998-09-11
CN110071206A2019-07-30
JP2002012653A2002-01-15
JP2018199786A2018-12-20
JP2020117619A2020-08-06
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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