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Patent Searching and Data


Title:
INSULATION PATTERN FORMING PROCESS
Document Type and Number:
WIPO Patent Application WO/2015/002316
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an insulation pattern forming process by which a desired pattern can be easily formed in patterning an insulation layer (3) by an ink-jet method. In patterning an insulation layer (3) by an ink-jet method, according to the insulation pattern forming process of the present invention, an insulation layer forming ink is applied to a substrate (1) so as to satisfy the requirement: (viscosity after landing on the substrate)/(viscosity at ejection) ≥ 100. The insulation layer forming ink has a phase change mechanism of hot melting, thixotropy or gelation.

Inventors:
YAMAUCHI MASAYOSHI (JP)
Application Number:
PCT/JP2014/067977
Publication Date:
January 08, 2015
Filing Date:
July 04, 2014
Export Citation:
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Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B05D1/26; G06F3/041; H05K3/46
Foreign References:
JP2010231287A2010-10-14
JP2005007266A2005-01-13
JP2007319821A2007-12-13
JP2012061658A2012-03-29
JP2010250733A2010-11-04
JP2011086084A2011-04-28
JP2014143237A2014-08-07
Attorney, Agent or Firm:
MARUYAMA EIICHI (JP)
Maruyama Eiichi (JP)
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