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Patent Searching and Data


Title:
INTEGRATED CIRCUIT PACKAGE ASSEMBLY WITH WIRE END ABOVE A TOPMOST COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/063674
Kind Code:
A3
Abstract:
Embodiments of the present disclosure describe integrated circuit (IC) package assemblies having one or more wires that extend beyond a topmost component in the IC package assembly, computing devices incorporating the IC package assemblies, methods for formation of the IC package assemblies, and associated configurations. An IC package assembly may include a substrate having a first side and a second side opposite the first side, an IC die having a first side and a second side opposite the first side, where the first side of the IC die faces the first side of the substrate, a wire electrically coupled with the IC die, where an end of the wire extends beyond a topmost component in the IC package assembly, and an overmold coupled with the topmost component. Other embodiments may be described and/or claimed.

Inventors:
GLENNAN WILLIAM T (US)
MADRIGAL FRANK D (US)
Application Number:
PCT/US2017/049157
Publication Date:
July 26, 2018
Filing Date:
August 29, 2017
Export Citation:
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Assignee:
INTEL CORP (US)
International Classes:
H01L23/498; H01L23/00; H01L25/07; H01L25/18
Foreign References:
JP2007123595A2007-05-17
US9349706B22016-05-24
KR101458954B12014-11-07
US8664757B22014-03-04
KR20160010648A2016-01-27
Attorney, Agent or Firm:
DANSKIN, Timothy A. et al. (US)
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