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Title:
INTEGRATED ELECTRONIC DEVICE WITH FLEXIBLE AND STRETCHABLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/156502
Kind Code:
A4
Abstract:
Disclosed herein is a flexible and stretchable integrated electronic device comprising a substrate having at least a first portion and a second portion, wherein a rigid electronic device is embedded within the substrate. The stiffness of the first portion and the second portion differ, creating a stiffness gradient within the substrate to prevent delamination at the interface between the substrate and the embedded device.

Inventors:
NASERIFAR NASER (US)
FEDDER GARY K (US)
LEDUC PHILIP R (US)
MAJIDI CARMEL (US)
BETTINGER CHRISTOPHER J (US)
Application Number:
PCT/US2017/021974
Publication Date:
November 02, 2017
Filing Date:
March 10, 2017
Export Citation:
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Assignee:
UNIV CARNEGIE MELLON (US)
International Classes:
A41D1/00; A61B5/00; A61B5/0402; B29C33/40; H01L21/56; H01L23/28; H05K1/02
Attorney, Agent or Firm:
OBERDICK, David, G. et al. (535 Smithfield Street Suite 130, Pittsburgh PA, US)
Download PDF:
Claims:
AMENDED CLAI MS

received by the International Bureau on 19 September 2017 (19.09.17)

CLAIMS

The invention claimed is:

1. A method of making an integrated electronic device having a stiffness gradient, the method comprising:

embedding a rigid electronic device in a substrate comprising an uncured polymer base, and

applying a curing agent to the substrate in a pattern,

wherein applying the curing agent in the pattern creates a portion of the substrate adjacent the embedded electronic device with a modulus in between a modulus of a portion of the substrate not adjacent to the embedded electronic device and the modulus of the rigid electronic device.

2. The method of claim 1, wherein the curing agent is applied using an inkjet device.

3. The method of claim 2, further comprising:

thinning the curing agent using a solvent.

4. The method of claim 3, wherein the solvent is selected from the group consisting of xylene and trichlorobenzene.

5. The method of claim 1 :

wherein the substrate comprises polydimethylsiloxane;

wherein applying the curing agent to the substrate in the pattern comprises: applying the curing agent to a first section adjacent to the rigid

electronic device at a ratio of base-to-curing agent of 5: 1; and applying the curing agent to a second section not adjacent to the rigid electronic device at a ratio of base-to-curing agent of 20: 1.

6. An integrated electronic device comprising:

a substrate having a stiffness gradient,

wherein the substrate has a stiffness gradient with a maximum

stiffness adjacent a rigid electronic device, wherein the rigid electronic device is embedded in the substrate.

7. The integrated electronic device of claim 6, further comprising: a first section of the substrate adjacent to the rigid electronic device and a second section of the substrate peripheral to the first section, wherein the second section has a lower stiffness than the first section and the first section has a lower stiffness than the rigid electronic device.

8. The integrated electronic device of claim 6, wherein the substrate comprises poly dimethyl siloxane .

9. The integrated electronic device of claim 6, wherein the substrate comprises: a first section adjacent the rigid electronic device,

wherein the first section has a first Young's modulus; a second section adjacent the first section,

wherein the second section has a second Young's modulus, wherein the second Young's modulus is less than the first Young's modulus.

10. The integrated electronic device of claim 6, further comprising:

a passive electronic device embedded in the substrate and connected to the rigid electronic device.

1 1. The integrated electronic device of claim 10, wherein the passive electronic device is selected from the group consisting of an antenna, a coil, and a wire.

12. The integrated electronic device of claim 6, wherein the stiffness gradient is continuous and extends radially from the rigid electronic device.

13. The method of claim 1, wherein the pattern comprises:

a first area of the substrate adjacent to the rigid electronic device and a second area not adjacent to the rigid electronic device, wherein the first area receives a greater amount of the curing agent.

14. The method of claim 1, wherein the pattern comprises a continuous gradient.

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15. The method of claim 1, wherein applying the curing agent to the substrate comprises:

applying the curing agent to a surface of the substrate; and

allowing the curing agent to diffuse into the substrate.

16. The method of claim 1, wherein the curing agent is applied manually.

17. The method of claim 2, wherein the substrate is heated as the curing agent is applied to the substrate.

18. The method of claim 2, wherein the inkjet device applies the curing agent in the pattern comprising a plurality of overlapping areas of increasing size, each of the plurality of overlapping areas located in part over the rigid electronic device, thereby creating a gradient in the amount of the curing agent applied to the substrate.

19. The method of claim 2, further comprising:

controlling diffusion of the curing agent by adjusting at least one of: a

temperature of the substrate, a viscosity of the curing agent, and a surface tension of the curing agent.

20. An integrated electronic device created by the method of claim 1.

21. The method of claim 1 , wherein applying the curing agent to the substrate in the pattern comprises:

applying the curing agent to a first section adjacent to the rigid electronic device to create a first base -to -curing agent ratio;

applying the curing agent to a second section not adjacent to the rigid

electronic device at a second base-to-curing agent ratio; wherein the first ratio is less than the second ratio.

22. The method of claim 1, wherein the substrate further comprises a curing agent mixed with the uncured polymer base.

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