Title:
INTEGRATED MULT-DEVICE CHIP AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2020/243875
Kind Code:
A1
Abstract:
A protection device may include a semiconductor substrate and a thyristor-type device, formed within the semiconductor substrate, where the thyristor device extends from a first main surface of the semiconductor substrate to a second main surface of the semiconductor substrate. The protection device may include a first PN diode, formed within the semiconductor substrate; and a second PN diode, formed within the semiconductor substrate, wherein the thyristor-type device is arranged in electrical series between the first PN diode and the second PN diode.
Inventors:
MOU TSUNG-WEN (CN)
SHI LEI (CN)
ZHOU JIFENG (CN)
SHI LEI (CN)
ZHOU JIFENG (CN)
Application Number:
PCT/CN2019/089797
Publication Date:
December 10, 2020
Filing Date:
June 03, 2019
Export Citation:
Assignee:
LITTELFUSE SEMICONDUCTOR WUXI CO LTD (CN)
International Classes:
H01L29/74; H01L29/732; H01L29/87
Foreign References:
| CN106356827A | 2017-01-25 | |||
| CN1131823A | 1996-09-25 | |||
| US5365086A | 1994-11-15 | |||
| US20040021148A1 | 2004-02-05 | |||
| CN105826366A | 2016-08-03 | |||
| US6559515B1 | 2003-05-06 |
Other References:
See also references of EP 3977518A4
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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