Title:
INTEGRATION OF METAL NANOWIRE NETWORK INTO CONDUCTING POLYMERS
Document Type and Number:
WIPO Patent Application WO/2021/073608
Kind Code:
A1
Abstract:
A metallic nanowire: conductive polymer composite is fabricated. A metallic nanowire layer is formed by a process that leaves an organic ligand residue on the metallic nanowire layer. A conductive polymer film is formed on a supporting substrate. The metallic nanowire layer is integrated with the conductive polymer film to form a metallic nanowire: conductive polymer composite. The metallic nanowire: conductive polymer composite is wet by a reaction solution including a source of metal ions, at least one acid, and a solvent for a period of time sufficient to remove the organic ligand residues from the metallic nanowire layer and sufficient to grow metal nanoparticles from the source of metal ions to create metal interconnections at junctions where the two or more nanowires in the metallic nanowire layer touch each other. Following growth of the nanoparticles, the nanowire: conductive polymer composite is removed from the reaction solution and dried.
Inventors:
CHOY CHIK HO (CN)
KIM JINWOOK (CN)
KIM JINWOOK (CN)
Application Number:
PCT/CN2020/121538
Publication Date:
April 22, 2021
Filing Date:
October 16, 2020
Export Citation:
Assignee:
UNIV HONG KONG (CN)
International Classes:
H01B1/12; H01B1/02; H01B13/00
Foreign References:
| CN108615582A | 2018-10-02 | |||
| US20160038909A1 | 2016-02-11 | |||
| CN103109391A | 2013-05-15 | |||
| CN107118563A | 2017-09-01 | |||
| CN106782769A | 2017-05-31 | |||
| CN108598288A | 2018-09-28 | |||
| CN103440896A | 2013-12-11 | |||
| US20140287639A1 | 2014-09-25 |
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
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