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Patent Searching and Data


Title:
INTERPOSER SUBSTRATE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/041376
Kind Code:
A1
Abstract:
Provided is an interposer substrate (104) wherein a plating stub conductor (145A) and a grounding conductor (162) form a capacitor (160A), and a plating stub conductor (145B) and the grounding conductor (162) form a capacitor (160B).  Each capacitance value of the capacitors (160A, 160B) is adjusted so that a phase difference between signals transmitted by differential transmission by using a signal line including a connecting wiring conductor (142A) and a signal line including a connecting wiring conductor (142B) is 180 degrees.

Inventors:
MINEGISHI AKIRA
URIU KAZUHIDE
YAMADA TORU
Application Number:
PCT/JP2009/004455
Publication Date:
April 15, 2010
Filing Date:
September 09, 2009
Export Citation:
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Assignee:
PANASONIC CORP (JP)
MINEGISHI AKIRA
URIU KAZUHIDE
YAMADA TORU
International Classes:
H01L23/12
Foreign References:
JP2001168236A2001-06-22
JP2004140295A2004-05-13
JP2005340676A2005-12-08
JP2005328032A2005-11-24
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (JP)
Mitsuo Tanaka (JP)
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